Title :
New insights into radiation-induced oxide-trap charge through thermally-stimulated-current measurement and analysis [MOS capacitors]
Author :
Fleetwood, D.M. ; Miller, S.L. ; Reber, R.A., Jr. ; McWhorter, P.J. ; Winokur, P.S. ; Shaneyfelt, M.R. ; Schwank, J.R.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fDate :
12/1/1992 12:00:00 AM
Abstract :
An analytical model with no free parameters has been developed which accurately describes thermally-stimulated-current (TSC) measurements spanning more than a factor of 50 in average heating rate. The model incorporates Schottky electric-field-induced barrier lowering and a temperature-dependent `attempt-to-escape frequency´ equal to ~10 14 Hz at 300°C. Applying this model to TSC measurements provides significantly improved estimates of the energy distribution of trapped holes in irradiated SiO2. All devices examined, including soft and (wet and dry) hard oxides from five process technologies, show similar energy distributions, with a minor peak at ~1.2 eV and a broad major peak centered ~1.7-2.0 eV above the SiO2 valance band. It is found that the trapped-electron density in irradiated SiO2 is proportional to the trapped-hole density over a wide range of irradiation conditions
Keywords :
X-ray effects; hole traps; interface electron states; metal-insulator-semiconductor devices; radiation hardening (electronics); thermally stimulated currents; MOS capacitors; Schottky electric-field-induced barrier lowering; Si-SiO2; TSC; X-ray irradiation; analytical model; hard oxides; irradiated SiO2; radiation hardened oxides; radiation-induced oxide-trap charge; soft oxides; temperature dependent attempt to escape frequency; thermally-stimulated-current; trapped hole energy distribution; trapped-electron density; trapped-hole density; Annealing; Capacitance measurement; Capacitance-voltage characteristics; Charge carrier processes; Charge measurement; Current measurement; Electron traps; Energy measurement; Thermal factors; Tunneling;
Journal_Title :
Nuclear Science, IEEE Transactions on