Study of temperature parameter on the thermosonic gold wire bonding of high-speed CMOS

Author

Hu, Shze J. ; Lim, G.E. ; Lim, Thiam L. ; Foong, Kar P.

Author_Institution

Sch. of Phys., Univ. Sains Malaysia, Penang, Malaysia

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

855

Lastpage

858

Abstract

A study of the temperature parameter on the thermosonic gold wire bonding of high-speed CMOS using a Shinkawa bonding machine (type UTC-10) was performed to determine the lowest possible bonding temperature. A full factorial statistical design of experiments to test the bonding temperature, bond force, and ultrasonic power parameters at three levels of setting each was carried out. Bond quality was evaluated using the ball shear test, wire bond pull test, and nonsticking on pad (NSOP) criteria. A smashed ball, bond to interconnect, and cratering defects were also investigated. The results show that the lowest possible temperature for bonding a particular high-speed CMOS metallization is 160°C. At this temperature, satisfactory bond quality can be obtained when the bond force and ultrasonic power parameters settings are within 30-50 g and 314-471 mW, respectively

Keywords

CMOS integrated circuits; gold; integrated circuit manufacture; lead bonding; ultrasonic applications; 160 C; 314 to 471 mW; Shinkawa bonding machine; UTC-10; ball shear test; bond force; bond to interconnect; bonding temperature; cratering defects; factorial statistical design of experiments; high-speed CMOS; lead frame bonding; lowest possible bonding temperature; nonsticking on pad; smashed ball; surface flaws elimination; temperature parameter; thermosonic Au wire bonding; ultrasonic power parameters; wire bond pull test; Aluminum; Bonding forces; Gold; Lead; Manufacturing processes; Metallization; Soldering; Temperature; Testing; Wire;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105145

Filename

105145