DocumentCode :
890000
Title :
Fast transient analysis of incident field coupling to multiconductor transmission lines
Author :
Shinh, Gurpreet S. ; Nakhla, Natalie M. ; Achar, Ram ; Nakhla, Michel S. ; Dounavis, Anestis ; Erdin, Ihsan
Author_Institution :
Carleton Univ., Ottawa, Ont.
Volume :
48
Issue :
1
fYear :
2006
Firstpage :
57
Lastpage :
73
Abstract :
Due to the rapid surge in operating frequencies and complexity of modern electronic designs, accurate/fast electromagnetic compatibility/interference analysis is becoming mandatory. This paper presents a closed-form SPICE macromodel for fast transient analysis of lossy multiconductor transmission lines in the presence of incident electromagnetic fields. In the proposed algorithm, the equivalent sources due to incident field coupling have been formulated so as to take an advantage of the recently developed delay extraction based passive transmission line macromodels. Also, a method to incorporate frequency-dependent per-unit-length parameters is presented. The time-domain macromodel is in the form of ordinary differential equations and can be easily included in SPICE like simulators for transient analysis. The proposed algorithm while guaranteeing the stability of the simulation by employing passive transmission line macromodel, provides significant speed-up for the incident field coupling analysis of multiconductor transmission line networks, especially with large delay and low losses
Keywords :
differential equations; electromagnetic compatibility; electromagnetic coupling; electromagnetic fields; electromagnetic interference; multiconductor transmission lines; time-domain analysis; transient analysis; closed-form SPICE macromodel; differential equations; electromagnetic compatibility; incident electromagnetic fields; incident field coupling; interference analysis; multiconductor transmission lines; passive transmission line macromodels; time-domain macromodel; transient analysis; Analytical models; Couplings; Electromagnetic compatibility; Electromagnetic compatibility and interference; Frequency; Multiconductor transmission lines; Propagation losses; SPICE; Surges; Transient analysis; Circuit simulation; EMI; delay extraction; distributed interconnects; electromagnetic coupling; high-speed modules; incident fields; method of characteristics; multiconductor transmission lines; passive macromodels; printed circuit boards; transient analysis;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2006.870694
Filename :
1614040
Link To Document :
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