A new method to determine contamination limited yield

Author

Hecht, Lewis

Author_Institution

IBM Corp., Endicott, NY, USA

Volume

14

Issue

4

fYear

1991

fDate

12/1/1991 12:00:00 AM

Firstpage

904

Lastpage

905

Abstract

A method to determine the sensitivity of any process to particle contaminants is proposed. Particles of known sizes are seeded at various known locations on the product at known steps. The resulting defects are then measured directly. This is illustrated by a detailed example. The advantages of this seeding method are as follows: (1) the entire experiment can be done quickly; (2) the experiment can be easily replicated; (3) large sample sizes are not needed; (4) and the time spent for inspection and measurement of defects is much less than in any of the previous methods

Keywords

integrated circuit manufacture; process control; contamination limited yield; known locations; known steps; particle contaminants; particle seeding method; particles of known size; particulate contamination; pollen particles; process sensitivity estimation; resulting defects; Inspection; Manufacturing processes; Mathematical model; Metallization; Printed circuits; Resists; Semiconductor device manufacture; Semiconductor device modeling; Surface contamination; Virtual manufacturing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.105153

Filename

105153