• DocumentCode
    890419
  • Title

    Fluidic self-assembly of InGaAs vertical cavity surface emitting lasers onto silicon

  • Author

    Tu, J.K. ; Talghader, J.J. ; Hadley, M.A. ; Smith, J.S.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • Volume
    31
  • Issue
    17
  • fYear
    1995
  • fDate
    8/17/1995 12:00:00 AM
  • Firstpage
    1448
  • Lastpage
    1449
  • Abstract
    Vertical cavity surface emitting lasers (VCSELs) have been successfully integrated by fluidic self-assembly (FSA) into 10 μm deep holes etched into an Si substrate. These 40×40×10 μm 3 devices were fully planarised and metallised after integration. The VCSELs operated pulsed at O.98 μm with a threshold current as low as 75 mA and a turn-on voltage of 2.9 V
  • Keywords
    III-V semiconductors; etching; gallium arsenide; indium compounds; integrated optoelectronics; laser cavity resonators; microassembling; optical fabrication; semiconductor lasers; surface emitting lasers; 0.98 micron; 2.9 V; 75 mA; InGaAs; OEIC; Si; Si substrate; VCSEL; etching; fluidic self-assembly; surface emitting lasers; vertical cavity SEL;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:19950989
  • Filename
    464171
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=890419