• DocumentCode
    890532
  • Title

    Enhancement-Mode AlN/GaN HFETs Using Cat-CVD SiN

  • Author

    Higashiwaki, Masataka ; Mimura, Takashi ; Matsui, Toshiaki

  • Author_Institution
    Nat. Inst. of Inf. & Commun. Technol., Tokyo
  • Volume
    54
  • Issue
    6
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    1566
  • Lastpage
    1570
  • Abstract
    High-performance enhancement-mode (E-mode) AIN (2.5 nm)/GaN heterostructure field-effect transistors (HFETs) were fabricated with a novel method using SiN passivation by catalytic chemical vapor deposition (Cat-CVD). We found that the formation of a 2-D electron gas (2DEG) in the AIN/GaN heterostructure can be controlled by the presence of the Cat-CVD SiN on the barrier layer. Before SiN deposition, the 2DEG at the AIN/GaN heterointerface was completely depleted because of the extremely thin barrier layer. On the other hand, after SiN deposition, the decrease in AIN surface barrier height induced a high-density 2DEG. The E-mode HFETs with gate lengths of 100-180 nm and threshold voltages from +0.14 to +0.55 V showed a maximum drain-current density of 0.70-0.92 A/mm and a maximum extrinsic transconductance of 362-400 mS/mm. A current-gain cutoff frequency of 87 GHz and maximum oscillation frequency of 149 GHz were obtained for the 100-nm-gate devices.
  • Keywords
    III-V semiconductors; aluminium compounds; chemical vapour deposition; gallium compounds; high electron mobility transistors; passivation; silicon compounds; two-dimensional electron gas; wide band gap semiconductors; 2D electron gas; 2DEG; AIN surface barrier height; AIN/GaN HFET; AIN/GaN heterointerface; AIN/GaN heterostructure field-effect transistors; AlN-GaN; E-mode heterostructure field-effect transistors; SiN; SiN deposition; SiN passivation; barrier layer; cat-CVD SiN; catalytic chemical vapor deposition; current-gain cutoff frequency; enhancement-mode HFET; enhancement-mode heterostructure field-effect transistors; maximum drain-current density; size 100 nm to 180 nm; size 2.5 nm; threshold voltages; voltage 0.14 V to 0.55 V; Chemical vapor deposition; Cutoff frequency; Electrons; Gallium nitride; HEMTs; MODFETs; Passivation; Silicon compounds; Threshold voltage; Transconductance; AlN; GaN; catalytic chemical vapor deposition (Cat-CVD); current-gain cutoff frequency $(f_{T})$; enhancement-mode (E-mode); heterostructure field-effect transistor (HFET); maximum oscillation frequency $(f_{max})$;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2007.896607
  • Filename
    4215179