DocumentCode :
890798
Title :
Highly Manufacturable Double-Gate FinFET With Gate-Source/Drain Underlap
Author :
Yang, Ji-Woon ; Zeitzoff, Peter M. ; Tseng, Hsing-Huang
Author_Institution :
SEMATECH Inc., Austin
Volume :
54
Issue :
6
fYear :
2007
fDate :
6/1/2007 12:00:00 AM
Firstpage :
1464
Lastpage :
1470
Abstract :
The speed performance of a double-gate (DG) FinFET CMOS with gate-source/drain (G-S/D) underlap is investigated using 2-D device and mixed-mode circuit simulation. By optimizing the G-S/D underlap, we demonstrate that the fin thickness of a DG FinFET can be significantly increased up to the physical gate length without degrading the speed performance compared to the conventional G-S/D overlap structure, where the fin thickness needs to be less than one-half of the physical gate length to control short-channel effects. Such an increase in fin thickness combined with a relaxed requirement for abruptness in the source/drain profile can dramatically enhance the manufacturability of DG FinFETs for the 32-nm technology node and beyond.
Keywords :
CMOS integrated circuits; MOSFET; circuit simulation; mixed analogue-digital integrated circuits; double-gate FinFET CMOS; fin thickness; gate length; gate-source/drain underlap; mixed-mode circuit simulation; short-channel effects; CMOS process; CMOS technology; Circuit simulation; Degradation; Doping; FinFETs; MOSFET circuits; Manufacturing; Silicon on insulator technology; Thickness control; CMOS field-effect transistors (CMOSFETs); Double-gate MOSFET (DG MOSFET); gate source/drain (G-S/D) underlap; short-channel effects (SCEs); silicon-on-insulator technology;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.896387
Filename :
4215207
Link To Document :
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