• DocumentCode
    890798
  • Title

    Highly Manufacturable Double-Gate FinFET With Gate-Source/Drain Underlap

  • Author

    Yang, Ji-Woon ; Zeitzoff, Peter M. ; Tseng, Hsing-Huang

  • Author_Institution
    SEMATECH Inc., Austin
  • Volume
    54
  • Issue
    6
  • fYear
    2007
  • fDate
    6/1/2007 12:00:00 AM
  • Firstpage
    1464
  • Lastpage
    1470
  • Abstract
    The speed performance of a double-gate (DG) FinFET CMOS with gate-source/drain (G-S/D) underlap is investigated using 2-D device and mixed-mode circuit simulation. By optimizing the G-S/D underlap, we demonstrate that the fin thickness of a DG FinFET can be significantly increased up to the physical gate length without degrading the speed performance compared to the conventional G-S/D overlap structure, where the fin thickness needs to be less than one-half of the physical gate length to control short-channel effects. Such an increase in fin thickness combined with a relaxed requirement for abruptness in the source/drain profile can dramatically enhance the manufacturability of DG FinFETs for the 32-nm technology node and beyond.
  • Keywords
    CMOS integrated circuits; MOSFET; circuit simulation; mixed analogue-digital integrated circuits; double-gate FinFET CMOS; fin thickness; gate length; gate-source/drain underlap; mixed-mode circuit simulation; short-channel effects; CMOS process; CMOS technology; Circuit simulation; Degradation; Doping; FinFETs; MOSFET circuits; Manufacturing; Silicon on insulator technology; Thickness control; CMOS field-effect transistors (CMOSFETs); Double-gate MOSFET (DG MOSFET); gate source/drain (G-S/D) underlap; short-channel effects (SCEs); silicon-on-insulator technology;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2007.896387
  • Filename
    4215207