Title :
High-performance vertical transition for broadband and millimetre-wave BGA module packaging
Author :
Kangasvieri, T. ; Halme, J. ; Vahakangas, J. ; Lahti, M.
Author_Institution :
Microelectron. & Mater. Phys. Labs., Univ. of Oulu, Oulu
Abstract :
A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full- wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.
Keywords :
ball grid arrays; high-speed integrated circuits; millimetre wave devices; ball-grid-array package transition; full-wave electromagnetic simulations; high-performance vertical transition; high-speed digital module packaging; insertion loss values; millimetre-wave BGA module packaging; return loss values;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20070948
