• DocumentCode
    891804
  • Title

    High-performance vertical transition for broadband and millimetre-wave BGA module packaging

  • Author

    Kangasvieri, T. ; Halme, J. ; Vahakangas, J. ; Lahti, M.

  • Author_Institution
    Microelectron. & Mater. Phys. Labs., Univ. of Oulu, Oulu
  • Volume
    43
  • Issue
    11
  • fYear
    2007
  • Firstpage
    638
  • Lastpage
    639
  • Abstract
    A high-performance ball-grid-array (BGA) package transition applicable in high-speed digital and millimetre-wave module packaging has been designed and fabricated. Measured results agreed well with full- wave electromagnetic simulations, showing return and insertion loss values better than 17 dB and 1 dB, respectively, up to 47 GHz.
  • Keywords
    ball grid arrays; high-speed integrated circuits; millimetre wave devices; ball-grid-array package transition; full-wave electromagnetic simulations; high-performance vertical transition; high-speed digital module packaging; insertion loss values; millimetre-wave BGA module packaging; return loss values;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20070948
  • Filename
    4216367
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=891804