DocumentCode
891880
Title
On the thermal isolation applications of V-groove technology
Volume
17
Issue
1
fYear
1982
fDate
2/1/1982 12:00:00 AM
Firstpage
90
Lastpage
93
Abstract
V-groove etching technology has been applied to the thermal isolation in an integrated circuit chip. Numerical calculation shows that V-groove structure brings about 50 percent improvement in normalized temperature when compared to the conventional planar structure.
Keywords
Etching; Integrated circuit technology; Large scale integration; etching; integrated circuit technology; large scale integration; Capacitance; Circuit simulation; Heat sinks; Integrated circuit technology; Isolation technology; Oscillators; Predictive models; SPICE; Temperature; Transconductance;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1982.1051694
Filename
1051694
Link To Document