DocumentCode
892082
Title
MOS Device and Technology Constraints in VLSI
Author
El-Mansy, Youssef
Volume
17
Issue
2
fYear
1982
fDate
4/1/1982 12:00:00 AM
Firstpage
197
Lastpage
203
Abstract
As devices and technology are scaled to achieve performance and density improvements, a number of constraints come into play. These constraints apply to both the parasitic as well as the intrinsic device and reduce the benefits that would have otherwise been available from scaling. In this paper, a number of performance limiters are pointed out. Specifically, velocity saturation, parasitic sourced-drain series resistance, finite channel thickness, and hot-carrier effects are analyzed and their effects on performance are evaluated. Future trends as impacted by these limiters are explored for both p- and n-charnel devices.
Keywords
Field effect integrated circuits; Hot carriers; Integrated circuit technology; Large scale integration; Heat treatment; Isolation technology; MOS devices; Oxidation; Plasma applications; Silicon; Thermal stresses; Very large scale integration; Voltage;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1982.1051716
Filename
1051716
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