• DocumentCode
    892082
  • Title

    MOS Device and Technology Constraints in VLSI

  • Author

    El-Mansy, Youssef

  • Volume
    17
  • Issue
    2
  • fYear
    1982
  • fDate
    4/1/1982 12:00:00 AM
  • Firstpage
    197
  • Lastpage
    203
  • Abstract
    As devices and technology are scaled to achieve performance and density improvements, a number of constraints come into play. These constraints apply to both the parasitic as well as the intrinsic device and reduce the benefits that would have otherwise been available from scaling. In this paper, a number of performance limiters are pointed out. Specifically, velocity saturation, parasitic sourced-drain series resistance, finite channel thickness, and hot-carrier effects are analyzed and their effects on performance are evaluated. Future trends as impacted by these limiters are explored for both p- and n-charnel devices.
  • Keywords
    Field effect integrated circuits; Hot carriers; Integrated circuit technology; Large scale integration; Heat treatment; Isolation technology; MOS devices; Oxidation; Plasma applications; Silicon; Thermal stresses; Very large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1982.1051716
  • Filename
    1051716