• DocumentCode
    896122
  • Title

    Evaluation of EMP Failure Models for Discrete Semiconductor Devices

  • Author

    Shoup, R.W. ; Hanson, R.J. ; Durgin, D.L.

  • Author_Institution
    Booz·Allen & Hamilton Inc. 2340 Alamo Avenue SE, Suite 207 Albuquerque, NM 87106
  • Volume
    28
  • Issue
    6
  • fYear
    1981
  • Firstpage
    4328
  • Lastpage
    4333
  • Abstract
    Empirical models are often used in EMP assessments of electronic equipment. Two such sets of models previously developed for prediction of EMP failure levels of discrete silicon bipolar semiconductor devices are evaluated. The sample mean and standard deviation of the ratio of failure model calculated to experimentally measured damage constant for each model and device type form the basis of the evaluation. The sample mean is used to evaluate the predictive accuracy of each model. The sample standard deviation is used to develop error bounds and to evaluate the recommended hierarchy of use of each of the model sets. The computerized data base SUPERSAP2 is the source of device numbers and experimental damage constants. Model input parameters are device electrical characteristics extracted from SUPERSAP2, vendor catalogs, and D.A.T.A. books.
  • Keywords
    Accuracy; Computer errors; EMP radiation effects; Electric variables; Electronic equipment; Measurement standards; Predictive models; Semiconductor devices; Silicon; Standards development;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1981.4335724
  • Filename
    4335724