DocumentCode :
896291
Title :
Integration of a double-polysilicon emitter-base self-aligned bipolar transistor into a 0.5-μm BiCMOS technology for fast 4-Mb SRAM´s
Author :
Hayden, James D. ; Burnett, J.D. ; Perera, Asanga H. ; Mele, Thomas C. ; Walczyk, Fred W. ; Kaushik, Vidya ; Lage, Craig S. ; See, Yee-Chaung
Author_Institution :
Motorola Inc., Austin, TX, USA
Volume :
40
Issue :
6
fYear :
1993
fDate :
6/1/1993 12:00:00 AM
Firstpage :
1121
Lastpage :
1128
Abstract :
The single-polysilicon non-self-aligned bipolar transistor in a 0.5-μm BiCMOS technology has been converted into a double-polysilicon emitter-base self-aligned bipolar transistor with little increase in process complexity. Improved bipolar performance in the form of smaller base resistance and base-collector capacitance, larger knee current, higher peak cutoff frequency, and shorter ECL gate delay has been demonstrated. This technology will prove useful in meeting the requirements for higher performance in fast, high-density, SRAM circuits
Keywords :
BiCMOS integrated circuits; SRAM chips; bipolar transistors; emitter-coupled logic; integrated circuit technology; silicon; 0.5 micron; 4 Mbit; BiCMOS technology; ECL gate delay; SRAM circuits; Si; base resistance; base-collector capacitance; bipolar performance; double-polysilicon emitter-base; knee current; peak cutoff frequency; self-aligned bipolar transistor; BiCMOS integrated circuits; Bipolar transistors; Bismuth; CMOS technology; Capacitance; Circuit synthesis; Cutoff frequency; Delay; Knee; Random access memory;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.214738
Filename :
214738
Link To Document :
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