• DocumentCode
    896749
  • Title

    A 60 ns 256Kx1 bit DRAM using LD/SUP 3/ technology and double-level metal interconnection

  • Author

    Kertis, Robert A. ; Fitzpatrick, Kelly J. ; Ohri, Kul B.

  • Volume
    19
  • Issue
    5
  • fYear
    1984
  • Firstpage
    585
  • Lastpage
    590
  • Abstract
    A high-speed 256K/spl times/1-bit DRAM, using new circuit design techniques and a scaled n-channel process, has been developed. A row access time of 60 ns has been achieved through the use of short-channel devices and two levels of low-resistance interconnect. A staggered matrix precharge was implemented to reduce peak supply current and dI/dt during row precharge. Supply current transients are particularly important at the 256K density level due to the fast cycle rates (approaching 10 MHz) and the large matrix capacitance to be precharged.
  • Keywords
    Field effect integrated circuits; Integrated memory circuits; Random-access storage; field effect integrated circuits; integrated memory circuits; random-access storage; Capacitance; Circuit synthesis; Current supplies; Decoding; Integrated circuit interconnections; MOSFETs; Propagation delay; Random access memory; Signal restoration; Wire;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1984.1052193
  • Filename
    1052193