DocumentCode
896749
Title
A 60 ns 256Kx1 bit DRAM using LD/SUP 3/ technology and double-level metal interconnection
Author
Kertis, Robert A. ; Fitzpatrick, Kelly J. ; Ohri, Kul B.
Volume
19
Issue
5
fYear
1984
Firstpage
585
Lastpage
590
Abstract
A high-speed 256K/spl times/1-bit DRAM, using new circuit design techniques and a scaled n-channel process, has been developed. A row access time of 60 ns has been achieved through the use of short-channel devices and two levels of low-resistance interconnect. A staggered matrix precharge was implemented to reduce peak supply current and dI/dt during row precharge. Supply current transients are particularly important at the 256K density level due to the fast cycle rates (approaching 10 MHz) and the large matrix capacitance to be precharged.
Keywords
Field effect integrated circuits; Integrated memory circuits; Random-access storage; field effect integrated circuits; integrated memory circuits; random-access storage; Capacitance; Circuit synthesis; Current supplies; Decoding; Integrated circuit interconnections; MOSFETs; Propagation delay; Random access memory; Signal restoration; Wire;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1984.1052193
Filename
1052193
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