DocumentCode
896871
Title
Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems
Author
Naeemi, Azad ; Meindl, James D.
Author_Institution
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA
Volume
54
Issue
1
fYear
2007
Firstpage
26
Lastpage
37
Abstract
Based on physical models, distributed circuit models are presented for single-walled carbon nanotubes (SWCNs) and SWCN bundles that are valid for all voltages and lengths. These models can be used for circuit simulations and compact modeling. It is demonstrated that by customizing SWCN interconnects at the local, semiglobal, and global levels, several major challenges facing gigascale integrated systems can potentially be addressed. For local interconnects, monolayer or multilayer SWCN interconnects can offer up to 50% reduction in capacitance and power dissipation with up to 20% improvement in latency if they are short enough (<20 mum). For semiglobal interconnects, either latency or power dissipation can be substantially improved if bundles of SWCNs are used. The improvements increase as the cross-sectional dimensions scale down. For global interconnects, bandwidth density can be improved by 40% if there is at least one metallic SWCN per 3-nm2 cross-sectional area
Keywords
carbon nanotubes; integrated circuit interconnections; circuit simulations; distributed circuit models; gigascale integrated systems; global interconnects; local interconnects; monolayer SWCN interconnects; multilayer SWCN interconnects; power dissipation; semiglobal interconnects; single-walled carbon nanotubes; Capacitance; Carbon nanotubes; Circuit simulation; Delay; Integrated circuit interconnections; Nonhomogeneous media; Power dissipation; Power system interconnection; Power system modeling; Voltage; Crosstalk; inductance; interconnects; molecular electronics; quantum wires; repeaters; system analysis and design; system optimization;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2006.887210
Filename
4039704
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