• DocumentCode
    896912
  • Title

    Comparison of Modeling Approaches for the Capacitance–Voltage and Current–Voltage Characteristics of Advanced Gate Stacks

  • Author

    Palestri, P. ; Barin, N. ; Brunel, D. ; Busseret, C. ; Campera, A. ; Childs, P.A. ; Driussi, F. ; Fiegna, C. ; Fiori, G. ; Gusmeroli, R. ; Iannaccone, G. ; Karner, M. ; Kosina, H. ; Lacaita, A.L. ; Langer, E. ; Majkusiak, B. ; Compagnoni, C. Monzio ; Ponc

  • Author_Institution
    Udine Univ.
  • Volume
    54
  • Issue
    1
  • fYear
    2007
  • Firstpage
    106
  • Lastpage
    114
  • Abstract
    In this paper, we compare the capacitance-voltage and current-voltage characteristics of gate stacks calculated with different simulation models developed by seven different research groups, including open and closed boundaries approaches to solve the Schroumldinger equation inside the stack. The comparison has been carried out on template device structures, including pure SiO2 dielectrics and high-kappa stacks, forcing the use of the same physical parameters in all models. Although the models are based on different modeling assumptions, the discrepancies among results in terms of capacitance and leakage current are small. These discrepancies have been carefully investigated by analyzing the individual modeling parameters and the internal quantities (e.g., tunneling probabilities and subband energies) contributing to current and capacitance
  • Keywords
    Schrodinger equation; dielectric materials; leakage currents; silicon compounds; Schrodinger equation; SiO2; SiO2 dielectrics; capacitance-voltage characteristics; current-voltage characteristics; gate stacks; high-k stacks; template device structures; Capacitance; Capacitance-voltage characteristics; Circuits; Dielectric devices; Differential equations; Leakage current; Microelectronics; Schrodinger equation; Semiconductor process modeling; Tunneling; Gate leakage; gate stacks; high-$kappa$ dielectric materials; tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2006.887226
  • Filename
    4039708