The application of laser process technology to thin film packaging

Author

Redmond, Thomas F. ; Lankard, John R. ; Balz, James G. ; Proto, George R. ; Wassick, Thomas A.

Author_Institution

IBM, Hopewell Junction, NY, USA

Volume

16

Issue

1

fYear

1993

fDate

2/1/1993 12:00:00 AM

Firstpage

6

Lastpage

12

Abstract

Laser process technologies have been developed which are well suited to the manufacture of thin-film electronic packages. The authors discuss three technologies-laser ablation, laser-assisted metal etching, and laser chemical vapor deposition-and how they may be used in polymer and metal patterning. The history of the technologies, process and tooling considerations, and specific applications are presented

Keywords

chemical vapour deposition; etching; integrated circuit manufacture; integrated circuit technology; laser ablation; laser beam applications; laser deposition; packaging; thin film circuits; CVD; laser ablation; laser chemical vapor deposition; laser process technology; laser-assisted metal etching; manufacture; metal patterning; polymer patterning; thin film packaging; Chemical lasers; Chemical technology; Electronics packaging; Etching; History; Laser ablation; Laser applications; Manufacturing processes; Polymer films; Transistors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.214854

Filename

214854