• DocumentCode
    897100
  • Title

    A low cost manufacturing process for high density hybrid components based on multilayer polyimide/ceramic structures

  • Author

    Tudanca, Manuel ; Luna, Ricardo G. ; Fraile, Aranzazu ; Triana, Javier ; Gonzalvez, Jose M. ; Vincueria, Ines ; Dominguez, Carlos F.

  • Author_Institution
    Dept. of Componentes y Tecnologia, Telettra Spain, Madrid, Spain
  • Volume
    16
  • Issue
    1
  • fYear
    1993
  • fDate
    2/1/1993 12:00:00 AM
  • Firstpage
    13
  • Lastpage
    20
  • Abstract
    The authors describe a multichip module component manufacturing process combining multilayer polyimide and multilayer low-temperature cofired ceramic structures, using the latter as the encapsulation support. A first characterization of the results is also reported
  • Keywords
    hybrid integrated circuits; integrated circuit manufacture; multichip modules; packaging; MLC; encapsulation support; high density hybrid components; low cost manufacturing process; low-temperature cofired ceramic; multichip module; multilayer polyimide/ceramic structures; Ceramics; Conducting materials; Conductive films; Costs; Dielectric substrates; Gold; Manufacturing processes; Multichip modules; Nonhomogeneous media; Polyimides;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.214855
  • Filename
    214855
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=897100