• DocumentCode
    897139
  • Title

    Rapid thermal curing of BCB dielectric

  • Author

    Garrou, Philip E. ; Heistand, Robert H. ; Dibbs, Mitchell G. ; Manial, T.A. ; Mohler, Carol E. ; Stokich, Theodore M. ; Townsend, Paul H. ; Adema, Gretchen M. ; Berry, Michelle J. ; Turlik, Iwona

  • Author_Institution
    Dow Chemical Co., Charlotte, NC, USA
  • Volume
    16
  • Issue
    1
  • fYear
    1993
  • fDate
    2/1/1993 12:00:00 AM
  • Firstpage
    46
  • Lastpage
    52
  • Abstract
    The feasibility of rapid thermal curing (RTC) of benzocyclobutene (BCB) thin films using an infrared belt furnace is demonstrated. The effects on film properties resulting from a dramatic reduction in cure time (5 h to 5 min) are summarized. The extent of cure was determined by Fourier-transform infrared (FTIR) methods and was subsequently modeled as a function of reaction kinetics using the measured temperature profiles. FTIR spectra from the RTC films were identical to those obtained using a conventional inert gas oven and a convectively heated belt furnace, indicating that the polymerization mechanisms and the resulting polymer network structure are identical and that no chemical enhancement of the curing occurs due to the absorption of infrared radiation. There are no statistically significant differences in the resulting stress and adhesion properties for samples cured by the RTC process versus the conventional process for film thicknesses ranging from 1 to 24 μm. Planarization measurements, made on isolated features up to 100 μm in width, also indicate no differences in the cured films
  • Keywords
    adhesion; dielectric thin films; infrared spectra of organic molecules and substances; polymer films; polymerisation; rapid thermal processing; 1 to 24 micron; 5 min; BCB dielectric; FTIR spectra; Fourier-transform infrared; IR radiation absorption; adhesion properties; benzocyclobutene; film properties; film thicknesses; infrared belt furnace; planarisation measurements; polymer network structure; polymerization mechanisms; rapid thermal curing; reaction kinetics; stress; temperature profiles; thin films; Belts; Chemicals; Curing; Dielectric thin films; Furnaces; Infrared heating; Kinetic theory; Ovens; Polymer films; Temperature measurement;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.214859
  • Filename
    214859