DocumentCode
897139
Title
Rapid thermal curing of BCB dielectric
Author
Garrou, Philip E. ; Heistand, Robert H. ; Dibbs, Mitchell G. ; Manial, T.A. ; Mohler, Carol E. ; Stokich, Theodore M. ; Townsend, Paul H. ; Adema, Gretchen M. ; Berry, Michelle J. ; Turlik, Iwona
Author_Institution
Dow Chemical Co., Charlotte, NC, USA
Volume
16
Issue
1
fYear
1993
fDate
2/1/1993 12:00:00 AM
Firstpage
46
Lastpage
52
Abstract
The feasibility of rapid thermal curing (RTC) of benzocyclobutene (BCB) thin films using an infrared belt furnace is demonstrated. The effects on film properties resulting from a dramatic reduction in cure time (5 h to 5 min) are summarized. The extent of cure was determined by Fourier-transform infrared (FTIR) methods and was subsequently modeled as a function of reaction kinetics using the measured temperature profiles. FTIR spectra from the RTC films were identical to those obtained using a conventional inert gas oven and a convectively heated belt furnace, indicating that the polymerization mechanisms and the resulting polymer network structure are identical and that no chemical enhancement of the curing occurs due to the absorption of infrared radiation. There are no statistically significant differences in the resulting stress and adhesion properties for samples cured by the RTC process versus the conventional process for film thicknesses ranging from 1 to 24 μm. Planarization measurements, made on isolated features up to 100 μm in width, also indicate no differences in the cured films
Keywords
adhesion; dielectric thin films; infrared spectra of organic molecules and substances; polymer films; polymerisation; rapid thermal processing; 1 to 24 micron; 5 min; BCB dielectric; FTIR spectra; Fourier-transform infrared; IR radiation absorption; adhesion properties; benzocyclobutene; film properties; film thicknesses; infrared belt furnace; planarisation measurements; polymer network structure; polymerization mechanisms; rapid thermal curing; reaction kinetics; stress; temperature profiles; thin films; Belts; Chemicals; Curing; Dielectric thin films; Furnaces; Infrared heating; Kinetic theory; Ovens; Polymer films; Temperature measurement;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.214859
Filename
214859
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