Title :
Equivalent circuit modeling of interconnects from time-domain measurements
Author :
Jong, Jyh-Ming ; Janko, Bozidar ; Tripathi, Vijai
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
fDate :
2/1/1993 12:00:00 AM
Abstract :
A technique for the equivalent circuit modeling of single and coupled uniform and nonuniform interconnects, including discontinuities such as bends and junctions in high-speed circuits and packages, is presented. The circuit models are extracted from time-domain reflection and transmission measurement (TDR/T). The SPICE simulated results for the extracted circuit models for typical single and coupled structures are compared with the measured data to validate the accuracy of the circuit models
Keywords :
equivalent circuits; modelling; packaging; SPICE simulated results; bends; coupled structures; discontinuities; equivalent circuit modeling; extracted circuit models; high-speed circuits; interconnects; junctions; packages; reflection measurement; time-domain measurements; transmission measurement; Circuit simulation; Coupling circuits; Data mining; Equivalent circuits; Impedance; Integrated circuit interconnections; Packaging; Reflection; Time domain analysis; Transmission line matrix methods;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
