Transmission properties of balanced interconnections

Author

Rainal, Attilio J.

Author_Institution

AT&T Bell Lab., Murray Hill, NJ, USA

Volume

16

Issue

1

fYear

1993

fDate

2/1/1993 12:00:00 AM

Firstpage

137

Lastpage

145

Abstract

The author develops simple equations for computing the characteristic impedances and crosstalk of both unbalanced and balanced interconnections in a lossless, homogeneous, microstrip configuration (signal conductors above a ground plane). The equations are applied to compare the crosstalk resulting from both types of interconnections having 4-mil conductor widths when the packaging density is three signals per 54 mils. Similar comparisons for other signal packing densities and impedances are also presented. It is shown that balanced interconnections are much more immune to noise pickup. Also, they are free of ground noise and radiate relatively little. A theoretical transformation is developed in order to apply the equations to conductors having rectangular or circular cross-sections. The equations yield values which agree well with experiment, and they can also be applied to help analyze the interconnections associated with fiber-optic transceivers, monolithic microwave integrated circuits, hybrid integrated circuits, and various multichip modules. The effect of the dielectric constant on crosstalk is also discussed

Keywords

MMIC; crosstalk; electric impedance; hybrid integrated circuits; microstrip lines; multichip modules; waveguide theory; MCM; MMIC; balanced interconnections; characteristic impedances; circular cross-sections; conductors; crosstalk; dielectric constant; fiber-optic transceivers; hybrid integrated circuits; microstrip configuration; monolithic microwave integrated circuits; multichip modules; noise pickup immunity; packaging; rectangular cross-section; transmission properties; Conductors; Crosstalk; Equations; Hybrid integrated circuits; Impedance; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit yield; Microstrip; Packaging;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.214870

Filename

214870