• DocumentCode
    897550
  • Title

    Numerical Modeling of Nonuniform Si Thermal Oxidation

  • Author

    Matsumoto, Hiroshi ; Fukuma, Masao

  • Volume
    20
  • Issue
    1
  • fYear
    1985
  • Firstpage
    52
  • Lastpage
    60
  • Abstract
    A general numerical model, which is suitable to describe nonuniform silicon thermal oxidation, is proposed. The oxidant diffusion through the growing oxide and the change in shape in the total system are modeled at the same time. A new formulation, based on the balance-of-force viewpoint, is accomplished for the description of the oxidation-induced deformation, taking viscoelasticity into account. Thus both compressive/tensile and shear components of stress vectors can be calculated. Utilization of distorted quadrangular grids also contributes to generalization of this model. Application of this model to LOCOS oxidation process simulations demonstrates good agreement in LOCOS shape between calculation results and experimental data and proves the feasibility of using this model in general 2-D oxidation simulations.
  • Keywords
    Digital simulation; Elemental semiconductors; Numerical methods; Oxidation; Silicon; Chemical processes; Compressive stress; Elasticity; Numerical models; Oxidation; Shape; Silicon; Tensile stress; Thermal stresses; Viscosity;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1985.1052276
  • Filename
    1052276