DocumentCode
897770
Title
Physical Limits of VLSI dRAM´s
Author
Lewyn, Lanny L. ; Meindl, James D.
Volume
20
Issue
1
fYear
1985
fDate
2/1/1985 12:00:00 AM
Firstpage
231
Lastpage
241
Abstract
This paper describes the physical limits of VLSI dynamic random-access memories (dRAM´s). To achieve memory capacities in the multimegabit range, the significant limits inherent in conventional dRAM technology must be identified and overcome. Limits associated with cell components may be circumvented using an approach that treats the dRAM as a subsystem, affording the opportunity to trade off cell scaling with new approaches to cell and storage array layout as well as sensing-circuit design. New limits determined by denser cell geometry, cosmic-ray protons, sense-amplifier thermal noise, and vertical fields in the storage-capacitor insulator then enable memory storage capacities to be extended to a range in excess of 64 Mbits.
Keywords
Field effect integrated circuits; Integrated circuit technology; Integrated memory circuits; Random-access storage; Semiconductor device models; VLSI; Buffer storage; Capacitors; Fabrication; Geometry; Insulation; Integrated circuit interconnections; Production; Protons; Very large scale integration; Voltage;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1985.1052298
Filename
1052298
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