• DocumentCode
    897803
  • Title

    Performance Limits of CMOS ULSI

  • Author

    Pfiester, James R. ; Shott, John D. ; Meindl, James D.

  • Volume
    20
  • Issue
    1
  • fYear
    1985
  • fDate
    2/1/1985 12:00:00 AM
  • Firstpage
    253
  • Lastpage
    263
  • Abstract
    An analytic MOST model has been developed to calculate accurately threshold voltage at submicrometer dimensions and to predict the sealing limits of digital CMOS circuits. Salient results show that for 2-V power-supply voltages, channel lengths as small as 0.14 μm for static E/E CMOS, 0.20 μm for static E/D CMOS, 0.29 μm for dynamic transmission-gate CMOS, and 0.45 μm for static E/D NMOS circuits are possible. At submicrometer dimensions, CMOS offers as much as a 3:1 sealing advantage in minimum channel length which translates to a 5:1 improvement in gate delay when compared to NMOS. Thus CMOS is projected as the dominant ULSI technology, not only due to its well known large operating margins, low static-power dissipation and design flexibility but also due to markedly superior speed.
  • Keywords
    CMOS integrated circuits; Insulated gate field effect transistors; Integrated circuit technology; Semiconductor device models; VLSI; Boron; Boundary conditions; Dielectric constant; Dielectrics and electrical insulation; Electrodes; Gaussian processes; Neodymium; Silicon; Solid state circuits; Ultra large scale integration;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.1985.1052301
  • Filename
    1052301