DocumentCode :
897803
Title :
Performance Limits of CMOS ULSI
Author :
Pfiester, James R. ; Shott, John D. ; Meindl, James D.
Volume :
20
Issue :
1
fYear :
1985
fDate :
2/1/1985 12:00:00 AM
Firstpage :
253
Lastpage :
263
Abstract :
An analytic MOST model has been developed to calculate accurately threshold voltage at submicrometer dimensions and to predict the sealing limits of digital CMOS circuits. Salient results show that for 2-V power-supply voltages, channel lengths as small as 0.14 μm for static E/E CMOS, 0.20 μm for static E/D CMOS, 0.29 μm for dynamic transmission-gate CMOS, and 0.45 μm for static E/D NMOS circuits are possible. At submicrometer dimensions, CMOS offers as much as a 3:1 sealing advantage in minimum channel length which translates to a 5:1 improvement in gate delay when compared to NMOS. Thus CMOS is projected as the dominant ULSI technology, not only due to its well known large operating margins, low static-power dissipation and design flexibility but also due to markedly superior speed.
Keywords :
CMOS integrated circuits; Insulated gate field effect transistors; Integrated circuit technology; Semiconductor device models; VLSI; Boron; Boundary conditions; Dielectric constant; Dielectrics and electrical insulation; Electrodes; Gaussian processes; Neodymium; Silicon; Solid state circuits; Ultra large scale integration;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.1985.1052301
Filename :
1052301
Link To Document :
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