DocumentCode
897803
Title
Performance Limits of CMOS ULSI
Author
Pfiester, James R. ; Shott, John D. ; Meindl, James D.
Volume
20
Issue
1
fYear
1985
fDate
2/1/1985 12:00:00 AM
Firstpage
253
Lastpage
263
Abstract
An analytic MOST model has been developed to calculate accurately threshold voltage at submicrometer dimensions and to predict the sealing limits of digital CMOS circuits. Salient results show that for 2-V power-supply voltages, channel lengths as small as 0.14 μm for static E/E CMOS, 0.20 μm for static E/D CMOS, 0.29 μm for dynamic transmission-gate CMOS, and 0.45 μm for static E/D NMOS circuits are possible. At submicrometer dimensions, CMOS offers as much as a 3:1 sealing advantage in minimum channel length which translates to a 5:1 improvement in gate delay when compared to NMOS. Thus CMOS is projected as the dominant ULSI technology, not only due to its well known large operating margins, low static-power dissipation and design flexibility but also due to markedly superior speed.
Keywords
CMOS integrated circuits; Insulated gate field effect transistors; Integrated circuit technology; Semiconductor device models; VLSI; Boron; Boundary conditions; Dielectric constant; Dielectrics and electrical insulation; Electrodes; Gaussian processes; Neodymium; Silicon; Solid state circuits; Ultra large scale integration;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1985.1052301
Filename
1052301
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