Development of 0.45-mm thick ultra-thin small outline package

Author

Omi, Susumu ; Maruyama, Tomoyo ; Ishio, Toshiya ; Narai, Atsuya ; Sota, Yoshiki ; Toyosawa, Kenji ; Fujita, Kazuya ; Maeda, Takamichi

Author_Institution

Central Res. Labs., Sharp Corp., Nara, Japan

Volume

18

Issue

3

fYear

1995

fDate

8/1/1995 12:00:00 AM

Firstpage

471

Lastpage

477

Abstract

The authors developed an ultra-thin small outline package (UTSOP) with a package thickness of 0.45 mm. In spite of its significant reduction relative to conventional TSOP´s (1.0-mm thick), the inner leads of the lead frame can be bonded to the electrodes on the chip with gold wire as with conventional plastic package. It is feasible since the lead that supports the chip (support lead) through insulating tape is placed on the top side of the chip. Establishing molding technology and overcoming problems such as warping of package or chip during assembly were key points in the development of the UTSOP. The UTSOP retains the same level of reliability as a TSOP

Keywords

integrated circuit packaging; integrated circuit reliability; lead bonding; plastic packaging; 0.45 mm; UTSOP; inner leads; molding technology; package thickness; plastic package; reliability; ultra-thin small outline package; warping; Assembly; Bonding; Electrodes; Electronics packaging; Gold; Insulation; Lead; Packaging machines; Plastic packaging; Wire;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.404104

Filename

404104