• DocumentCode
    897861
  • Title

    Simultaneous switching noise: influence of plane-plane and plane-signal trace coupling

  • Author

    Vaidyanath, Arun ; Thoroddsen, Birgir ; Prince, John L. ; Cangellaris, Andreas C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
  • Volume
    18
  • Issue
    3
  • fYear
    1995
  • fDate
    8/1/1995 12:00:00 AM
  • Firstpage
    496
  • Lastpage
    502
  • Abstract
    The paper presents an aspect of simultaneous switching noise (SSN) for CMOS drivers in packages with power distribution planes. The analysis takes into account the interactions between power distribution planes and signal traces. Coupling between these have a significant effect on the noise and must be taken into account. A model for the interaction between the signal conductors and the current paths in the power distribution planes is presented. The presence of the signal conductors is seen to have a significant impact on the SSN. The magnitude of the noise is strongly dependent on the relative positions of the signal conductors and the power and ground plane pin connections. Power and ground planes sufficiently close to each other also have significant mutual inductive coupling. This coupling will cause noise to be observed in both distribution planes, even though switching current flows in only one plane. This effect is explained
  • Keywords
    CMOS integrated circuits; conductors (electric); integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; CMOS drivers; IC packaging conditions; current paths; ground plane pin connections; multilayer package; mutual inductive coupling; plane-plane trace coupling; plane-signal trace coupling; power distribution planes; signal conductors; simultaneous switching noise; Conductors; Coupling circuits; Driver circuits; Mutual coupling; Nonhomogeneous media; Packaging; Pins; Power distribution; Semiconductor device noise; Signal analysis;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.404109
  • Filename
    404109