Title :
Simultaneous switching noise: influence of plane-plane and plane-signal trace coupling
Author :
Vaidyanath, Arun ; Thoroddsen, Birgir ; Prince, John L. ; Cangellaris, Andreas C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fDate :
8/1/1995 12:00:00 AM
Abstract :
The paper presents an aspect of simultaneous switching noise (SSN) for CMOS drivers in packages with power distribution planes. The analysis takes into account the interactions between power distribution planes and signal traces. Coupling between these have a significant effect on the noise and must be taken into account. A model for the interaction between the signal conductors and the current paths in the power distribution planes is presented. The presence of the signal conductors is seen to have a significant impact on the SSN. The magnitude of the noise is strongly dependent on the relative positions of the signal conductors and the power and ground plane pin connections. Power and ground planes sufficiently close to each other also have significant mutual inductive coupling. This coupling will cause noise to be observed in both distribution planes, even though switching current flows in only one plane. This effect is explained
Keywords :
CMOS integrated circuits; conductors (electric); integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; CMOS drivers; IC packaging conditions; current paths; ground plane pin connections; multilayer package; mutual inductive coupling; plane-plane trace coupling; plane-signal trace coupling; power distribution planes; signal conductors; simultaneous switching noise; Conductors; Coupling circuits; Driver circuits; Mutual coupling; Nonhomogeneous media; Packaging; Pins; Power distribution; Semiconductor device noise; Signal analysis;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
