A self-aligned optical subassembly for multi-mode devices

Author

Dautartas, Mino F. ; Blonder, Greg E. ; Wong, Yiu-Huen ; Chen, Y.C.

Author_Institution

AT&T Bell Labs., Breinigsville, PA, USA

Volume

18

Issue

3

fYear

1995

fDate

8/1/1995 12:00:00 AM

Firstpage

552

Lastpage

557

Abstract

A completely self-aligned optical sub-assembly is described that meets the optical alignment tolerances needed for low-loss LED and PIN photodiode OSA´s. Solder reflow aligns the optical device (LED or PIN photodiode) to a silicon “header,” which is mechanically aligned to a silicon fiber stub with fiducial cavities and alignment spheres. This assembly is in turn mounted in a plastic ferrule. Devices made using this alignment scheme have demonstrated losses as low as 0.5 dB relative to a butt-coupled fiber measurement

Keywords

FDDI; light emitting diodes; optical communication equipment; optical fabrication; optical fibre communication; p-i-n photodiodes; soldering; transceivers; 0.5 dB; LED OSA; PIN photodiode OSA; alignment spheres; butt-coupled fiber measurement; fiber stub; fiducial cavities; multi-mode devices; optical alignment tolerances; optical transceivers; plastic ferrule; self-aligned optical subassembly; solder reflow; Assembly; Bonding; Costs; Lead; Light emitting diodes; Optical devices; Optical fiber devices; PIN photodiodes; Plastics; Silicon;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.404115

Filename

404115