Title :
A Wafer-Scale Digital Integrator Using Restructurable VSLI
Author :
Raffel, J.I. ; Anderson, A.H. ; Chapman, G.H. ; Konkle, K.H. ; Mathur, B. ; Soares, A.M. ; Wyatt, P.W.
Abstract :
Wafer-scale integration has been demonstrated by fabricating a digital integrator on a monolithic 20-cm/sup 2/ silicon chip, the first laser-restructured digital logic system. Large-area integration is accomplished by laser programming of metal interconnect for defect avoidance. This paper describes the technology for laser welding and cutting, the design methodology and CAD tools developed for wafer-scale integration, and the integrator itself.
Keywords :
CMOS integrated circuits; Cellular arrays; Circuit layout CAD; Digital arithmetic; Integrated circuit technology; Laser beam applications; Redundancy; Design automation; Design methodology; Dielectrics; Joining processes; Laser beam cutting; Optical device fabrication; Silicon; Wafer scale integration; Welding; Wiring;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.1985.1052320
