DocumentCode
898369
Title
Electrical characteristics of textured polysilicon oxide prepared by a low-temperature wafer loading and N/sub 2/ preannealing process
Author
Wu, Shye Lin ; Lin, Ta Yow ; Lee, Chung Len ; Lei, Tai Fu
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
14
Issue
3
fYear
1993
fDate
3/1/1993 12:00:00 AM
Firstpage
113
Lastpage
114
Abstract
A low-temperature wafer loading and N/sub 2/ preannealing process was used to grow a thin textured polysilicon oxide. The polyoxide grown on the heavily doped polysilicon film exhibits less oxide tunneling leakage current and higher dielectric strength when the top electrode is positively biased.<>
Keywords
CVD coatings; annealing; chemical vapour deposition; dielectric thin films; electric breakdown of solids; electric strength; electronic conduction in insulating thin films; leakage currents; semiconductor-insulator boundaries; silicon compounds; surface texture; N/sub 2/ preannealing process; SiO/sub 2/-Si; breakdown field; dielectric strength; electrical characteristics; heavily doped polysilicon film; low-temperature wafer loading; oxide tunneling leakage current; polycrystalline Si; polyoxide; textured polysilicon oxide; Dielectric breakdown; Electric variables; Electrodes; Grain boundaries; Leakage current; Oxidation; Temperature; Thermal stresses; Tunneling; Turning;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.215128
Filename
215128
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