DocumentCode
898877
Title
Defect size variations and their effect on the critical area of VLSI devices
Author
Ferris-Prabhu, Albert V.
Volume
20
Issue
4
fYear
1985
fDate
8/1/1985 12:00:00 AM
Firstpage
878
Lastpage
880
Abstract
The effect on VLSI device yield of variations in the size of defects has not been widely recognized until recently, when the theory of critical areas and fault probabilities was developed. It is shown that assumptions regarding the defect size distribution can substantially affect the computed critical area.
Keywords
Fault location; Short-circuit currents; VLSI; fault location; short-circuit currents; Circuit faults; Conductors; Distributed computing; Equations; Geometry; Insulation; Kernel; Semiconductor devices; Substrates; Very large scale integration;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.1985.1052404
Filename
1052404
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