DocumentCode
899165
Title
A method for preparing and bonding ultrasonic transducers used in high frequency digital delay lines
Author
Sittig, E.K.
Volume
56
Issue
8
fYear
1968
Firstpage
1375
Lastpage
1376
Abstract
Cold-welding indium layers deposited on metal films constitutes a bonding method for the transducers of ultrasonic delay lines suitable for operation at bit rates beyond 100 MHz. This method permits the use of transducer materials with high coupling factor, resulting in delay lines with comparatively low insertion loss.
Keywords
Acoustic transducers; Bit rate; Bonding; Delay lines; Electrodes; Frequency; Impedance; Indium; Insertion loss; Ultrasonic transducers;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1968.6597
Filename
1448527
Link To Document