Modeling and analysis of substrate coupling in integrated circuits

Author

Gharpurey, Ranjit ; Meyer, Robert G.

Author_Institution

Circuit Technol. Lab., Texas Instrum. Inc., Dallas, TX, USA

Volume

31

Issue

3

fYear

1996

fDate

3/1/1996 12:00:00 AM

Firstpage

344

Lastpage

353

Abstract

This paper describes a fast and accurate simulator for characterizing the effects of substrate coupling on integrated-circuit performance. The technique uses the electrostatic Green function of the substrate medium and the fast Fourier transform algorithm. It is demonstrated that this technique is suitable for optimization of layout for minimization of substrate coupling. Analysis of substrate coupling in different types of substrates and the utility of guard rings in different types of substrates is also discussed. Experimental verification of the models is presented

Keywords

Green´s function methods; equivalent circuits; fast Fourier transforms; integrated circuit layout; integrated circuit modelling; substrates; FFT algorithm; IC performance; electrostatic Green function; fast Fourier transform; guard rings; integrated circuits; layout optimization; models; substrate coupling; Circuit simulation; Coupling circuits; Dielectric substrates; Electrostatics; Fast Fourier transforms; Green function; Impedance; Integrated circuit modeling; Packaging; Power dissipation;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/4.494196

Filename

494196