• DocumentCode
    899649
  • Title

    Transition Structures for 3-D Integration of Substrate Integrated Waveguide Interconnects

  • Author

    Suntives, Asanee ; Abhari, Ramesh

  • Author_Institution
    McGill Univ., Montreal
  • Volume
    17
  • Issue
    10
  • fYear
    2007
  • Firstpage
    697
  • Lastpage
    699
  • Abstract
    Two transition structures, via and aperture transitions, used for 3-D integration of substrate integrated waveguide interconnects are investigated in this letter. Equivalent circuits for both structures are presented and evaluated through parametric studies and error analysis in comparison with fullwave simulations. The models are also validated by measurements of two test-boards containing the via and aperture transitions.
  • Keywords
    equivalent circuits; error analysis; interconnections; waveguide transitions; 3D integration; aperture transitions; equivalent circuits; error analysis; integrated waveguide interconnects; Analytical models; Apertures; Circuit simulation; Circuit testing; Equivalent circuits; Error analysis; Integrated circuit interconnections; Integrated circuit measurements; Parametric study; Waveguide transitions; Aperture transition; modeling; substrate integrated waveguide (SIW); via transition;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2007.905592
  • Filename
    4336149
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=899649