A Design and Packaging Technique for a High-Gain, Gigahertz-Band Single-Chip Amplifier

Author

Akazawa, Yukio ; Ishihara, Noboru ; Wakimoto, Tsutomu ; Kawarada, Kuniyasu ; Konaka, Shinsuke

Volume

21

Issue

3

fYear

1986

fDate

6/1/1986 12:00:00 AM

Firstpage

417

Lastpage

423

Abstract

Equalizing amplifiers for gigabit optical fiber transmission systems requires a 65-dB gain (S21) with a gigahertz bandwidth. However, this gain has the potential to cause significant parasitic oscillation. Consequently, developing a useful stabilization design technique is a very important factor in attaining practical design. In this paper, stabilization design techniques are described for circuit configurations, packaging, and stability assessment. In addition, fabrication results of amplifier IC based on bipolar super self-aligned process technology (SST) and new wide-band high isolation package with coaxial-like 50-Ω signal lines are also shown. A 65-dB gain, 1.3-GHz bandwidth single-chip amplifier has been successfully fabricated.

Keywords

Broadband amplifiers; Monolithic integrated circuits; Packaging; Bandwidth; Bipolar integrated circuits; Broadband amplifiers; Circuit stability; Fabrication; Optical amplifiers; Optical fiber amplifiers; Optical fibers; Packaging; Semiconductor optical amplifiers;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/JSSC.1986.1052544

Filename

1052544