Embedded IC and high-Q passives technology for ultra-compact Ku-band VCO module

Author

Pinel, S. ; Lee, Chia-Han ; Yoon, S.-W. ; Nuttinck, S. ; Lim, Khan ; Laskar, J.

Author_Institution

Yamacraw Design Center, Georgia Inst. of Technol., Atlanta, GA, USA

Volume

14

Issue

2

fYear

2004

Firstpage

80

Lastpage

82

Abstract

We present a novel ultra-compact embedded IC integration approach for system-on-package (SOP) based solutions for RF and wireless communication applications. This concept is applied to the integration of a Ku band VCO module. The module fabrication is described and the impact of the packaging on the chip-set performances is discussed. The final thickness of the module is about 150 μm. The embedded VCO exhibits an oscillation frequency of 15.4 GHz, a phase noise of -99.2 dBc/Hz at a 1 MHz offset and maximum output power of 10.67 dBm. Multilayer interconnects built with modified MCM-D technology using advanced photosensitive epoxy Intervia 8000 is described. Characterization and modeling of RF inductors are detailed and show quality factor as high as 80 at 10 GHz.

Keywords

integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; multichip modules; system-on-chip; voltage-controlled oscillators; 10 GHz; 15.4 GHz; Intervia 8000; MCM-D technology; RF communication; RF inductors; chip packaging; chip-set performances; embedded IC; high-Q passives technology; multilayer interconnects; oscillation frequency; output power; phase noise; photosensitive epoxy; quality factor; system-on-package; ultra-compact ku-band VCO module; wireless communication; Application specific integrated circuits; Fabrication; Nonhomogeneous media; Packaging; Phase noise; Power generation; Radio frequency; Radiofrequency integrated circuits; Voltage-controlled oscillators; Wireless communication;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2003.818529

Filename

1268104