Title :
Wideband package using an electromagnetic absorber
Author :
Iwasaki, Naoki ; Katsura, Kenshiro ; Kukutsu, Naoya
Author_Institution :
NTT Interdisciplinary Research Labs., Tokyo, Japan
fDate :
5/13/1993 12:00:00 AM
Abstract :
A novel wideband and resonance-free package is proposed. The placement of the electromagnetic absorber was investigated to maximise the reduction of cavity resonance. The results show that the optimum position is at the corners of the cavity. A package with a cutoff frequency of approximately 23 GHz was modified to achieve a frequency range up to at least 60 GHz.
Keywords :
electromagnetic wave absorption; integrated circuit technology; microwave integrated circuits; packaging; 60 GHz; EHF; MIC; SHF; cavity resonance; cutoff frequency; electromagnetic absorber; resonance-free package;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19930584
