DocumentCode :
902190
Title :
Thick-film hybrid technology for low-output-voltage DC/DC converter
Author :
Pernía, Alberto M. ; Prieto, Miguel J. ; Lopera, Juan Manuel ; Reilly, John ; Linton, Samuel S. ; Quiñones, Carlos
Author_Institution :
Grupo de Electron. Ind., Univ. de Oviedo, Gijon, Spain
Volume :
40
Issue :
1
fYear :
2004
Firstpage :
86
Lastpage :
93
Abstract :
The new requirements in portable and telecommunication equipment also affect the supply systems. The current tendency to lower the output voltage (3.3, 2.7 VDC) together with the necessity of an important size reduction is modifying the strategies for dc/dc converter implementation. Low-voltage high-power-density applications present two important factors that must be analyzed: thermal problems due to high power density, and the high currents to be handled. This paper presents a 10-W dc/dc buck converter with passive integration using hybrid technology (within the frame of ESPRIT Project 23910.). As a result of the mentioned integration technique, a power density of 6.25 W/cm3 was obtained with high efficiency (approximately 90%).
Keywords :
DC-DC power convertors; electric current; hybrid power systems; magnetic devices; telecommunication power supplies; thick film capacitors; thick film inductors; 10 W; 2.7 V; 3.3 V; DC-DC converter; ESPRIT project 23910; buck converter; capacitor module; high currents; high-power-density applications; inductor design; low voltage; low-output-voltage; magnetic components; passive integration; planar integrated structure; planar magnetic device; portable telecommunication equipment; power supply systems; power topology; size reduction; telecommunication temperature range; thermal problems; thick-film hybrid technology; Buck converters; Capacitors; Conducting materials; DC-DC power converters; Frequency; Helium; Industry Applications Society; Low voltage; Substrates; Thermal factors;
fLanguage :
English
Journal_Title :
Industry Applications, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-9994
Type :
jour
DOI :
10.1109/TIA.2003.821814
Filename :
1268183
Link To Document :
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