Abstract :
A new package is designed which will satisfy both the requirements of better electrical performance and efficient heat dissipation for use with high power multichip stacked varactor application. This is achieved by separating the electrical path from the heat path. The total heat dissipation capability is estimated to be about an order of magnitude higher than that of the conventional package. A doubler was built with six chips in one package. It handled 80 watts input power at 0.9 GHz and delivered 52 watts at the output frequency of 1.8 GHz.
