• DocumentCode
    905215
  • Title

    Thermal resistance of gallium-arsenide field-effect transistors

  • Author

    Webb, P.W. ; Russell, I.A.D.

  • Author_Institution
    Sch. of Electron. & Electr. Eng., Birmingham Univ., UK
  • Volume
    136
  • Issue
    5
  • fYear
    1989
  • fDate
    10/1/1989 12:00:00 AM
  • Firstpage
    229
  • Lastpage
    234
  • Abstract
    The authors describe some thermal simulations for heat flow in gallium-arsenide field-effect transistors where the effects of surface metallisation and via holes are modelled. The results were found to be significantly different to those previously published, which were based on simpler physical models. The effects of surface metallisation were found to be important in modelling the thermal resistance, but the effects of via holes less so, using current technological limitations.
  • Keywords
    III-V semiconductors; field effect transistors; gallium arsenide; heat transfer; metallisation; semiconductor device models; thermal analysis; thermal resistance; GaAs; III-V semiconductors; field-effect transistors; heat flow; modelling; surface metallisation; thermal resistance; thermal simulations; via holes;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings G
  • Publisher
    iet
  • ISSN
    0956-3768
  • Type

    jour

  • Filename
    216667