Modelling of crosstalk among the GaAs-based VLSI interconnections

The authors have developed a computer-efficient model and carried out computer simulations of the crosstalk effects in single, bi- and trilevel high-density interconnections on GaAs-based VHSIC. The self and coupling interconnection capacitances used in the model have been determined by a network analogue method developed for finite-length interconnections, open substrates and finite dimensions of the bottom ground plane, as well as by the method of moments in conjunction with a Green´s function appropriate for the geometry of the interconnections. Related software modules have been developed and run successfully on mainframe computers. For a given set of the interconnection dimensions and other parameters, the algorithm takes less than 5 minutes of computer processing time on a mainframe computer. The modules have been used to study the dependence of the crosstalk voltage on the interconnection dimensions such as their lengths, widths, separations and the interlevel distances.