• DocumentCode
    906759
  • Title

    The formula: world class manufacturing for hybrid thin-film component production

  • Author

    Berg, Rachel ; Smith, David

  • Author_Institution
    Pittiglio Rabin Todd & McGrath, Mountain View, CA, USA
  • Volume
    6
  • Issue
    2
  • fYear
    1993
  • fDate
    5/1/1993 12:00:00 AM
  • Firstpage
    170
  • Lastpage
    177
  • Abstract
    In less than one year, Avantek´s hybrid thin film component (HTFC) production operation transformed itself into a showcase for successful world class manufacturing (WCM). Production cycle time was reduced by 60%, work-in-process inventory was reduced by 92%, and overall process yields were improved by over 15%. WCM for this HTFC operation included the application of a number of productivity concepts. The proper mix of just-in-time (JIT), total quality management (TQM) and employee involvement concepts has transformed this operation into a powerful competitive tool for the company. The authors describe the steps taken to empower HTFC´s employees and to develop a teamwork approach. While the success of this approach intertwines with other WCM tools, teamwork has created infectious group enthusiasm for TQM-like problem solving while eliminating non-value-added activity required by JIT
  • Keywords
    hybrid integrated circuits; integrated circuit manufacture; management; production control; quality control; stock control; thin film circuits; Avantek; JIT; TQM; employee involvement; hybrid thin-film component production; just-in-time; process yields; production cycle time-reduction; teamwork approach; total quality management; work-in-process inventory; world class manufacturing; Circuits; Conducting materials; Manufacturing processes; Production; Productivity; Semiconductor device manufacture; Semiconductor thin films; Substrates; Total quality management; Transistors;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.216936
  • Filename
    216936