DocumentCode :
907541
Title :
Effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packages
Author :
Amagai, Masazumi
Author_Institution :
NPD Dept., Texas Instrum., Oita, Japan
Volume :
19
Issue :
2
fYear :
1996
fDate :
5/1/1996 12:00:00 AM
Firstpage :
301
Lastpage :
309
Abstract :
The increasingly severe demands of concurrently increasing die size, while reducing package size, have made the mechanical stability of novel tapeless lead-on-chip (LOC) packaging technologies a grave concern. The dominant issue is device failure, due to package cracking, caused by interfacial delamination between the adhesive-coated chip surface and the epoxy molding compound. To investigate the effect of adhesive surface morphology and chemistry on the epoxy molding compound, devices were fabricated with different types of adhesives. The samples were characterized with scanning acoustic tomography (SAT), X-ray photo emission spectroscopy (XPS), atomic force microscopy (AFM), attenuated total reflection (ATR), peel tests, and various package-level reliability tests. The results of the characterization and an explanation of the primary factors affecting interfacial adhesion are presented in this paper
Keywords :
adhesion; cracks; delamination; integrated circuit packaging; lead bonding; surface chemistry; surface structure; X-ray photoemission spectroscopy; adhesive coating; atomic force microscopy; attenuated total reflection; cracking; device failure; epoxy molding compound; interfacial delamination; mechanical stability; peel tests; reliability tests; scanning acoustic tomography; surface chemistry; surface morphology; tapeless lead-on-chip packages; Acoustic testing; Atomic force microscopy; Chemical technology; Chemistry; Delamination; Lab-on-a-chip; Packaging; Stability; Surface cracks; Surface morphology;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.496033
Filename :
496033
Link To Document :
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