An experimental technique for full package inductance matrix characterization

Author

Tsai, Chi-Taou ; Yip, Wai-Yeung

Author_Institution

Adv. Package Design & Automation Center, Motorola Inc., Chandler, AZ, USA

Volume

19

Issue

2

fYear

1996

fDate

5/1/1996 12:00:00 AM

Firstpage

338

Lastpage

343

Abstract

A new experimental technique based on a network analyzer was developed for characterizing the full inductance matrices (both self and mutual inductance) of package/interconnect structures. This frequency-domain based measurement technique, including its formulation and procedure, is discussed in this paper. A total of four packages, an 120QFP, a 400TAB, a 313PBGA, and an Alloy 42 132CQFP were selected for the self/mutual L characterization. The measurement results are compared to those obtained by using a time domain reflectometer (TDR)-based technique as well as with the modeling data calculated by 3-D EM tools

Keywords

frequency-domain analysis; inductance measurement; integrated circuit packaging; matrix algebra; 120QFP; 313PBGA; 400TAB; Alloy 42 132CQFP; frequency-domain measurement; inductance matrix; interconnects; mutual inductance; network analyzer; packages; self inductance; Bonding; Electric resistance; Electronics packaging; Frequency domain analysis; Frequency measurement; Inductance; Integrated circuit interconnections; Integrated circuit packaging; Lead; RLC circuits;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.496037

Filename

496037