Title :
Electrical performance of interconnects in polyimide-copper thin-film multilayers on ceramic substrate
Author :
Bedouani, Mohamed ; Lambert, Daniel ; Kurzweil, Karel
Author_Institution :
Bull SA, Les Clayes sous Bois, France
fDate :
5/1/1996 12:00:00 AM
Abstract :
Thin-film multilayer substrate technology with dielectric layers made of polyimide resin requires openings on the ground plane for the outgassing of the resin. This paper describes a full electrical characterization of transmission lines in a multichip module based on thin-film multilayer on ceramic. Both time and frequency domain methods were used for the experimental characterization. Measured and modeled performances are compared for three kinds of ground opening geometries
Keywords :
ceramics; copper; integrated circuit interconnections; multichip modules; polymer films; substrates; thin film circuits; Cu; MCM; MCM-D technology; ceramic substrate; electrical performance; experimental characterization; frequency domain methods; ground opening geometries; interconnects; multichip module; polyimide resin; polyimide-Cu thin-film multilayers; resin outgassing; time domain methods; transmission lines; Ceramics; Dielectric measurements; Dielectric substrates; Dielectric thin films; Frequency domain analysis; Multichip modules; Nonhomogeneous media; Polyimides; Resins; Transmission line measurements;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
