• DocumentCode
    907672
  • Title

    Limitation of the signal pin density on wiring boards

  • Author

    Chiba, Tsuneyo ; Yamada, Minoru ; Kobayashi, Fumiyuki

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Tokyo, Japan
  • Volume
    19
  • Issue
    2
  • fYear
    1996
  • fDate
    5/1/1996 12:00:00 AM
  • Firstpage
    391
  • Lastpage
    396
  • Abstract
    A practical limit of the signal pin density on wiring boards is investigated from the wireability point of view. The wireability problem can be expressed as a supply and demand model of two resources, i.e. wiring channels and via-holes. The limit of the signal pin density is assumed to be determined by the shortage of either of these two resources. As a measure of pin density, the average distance between adjacent signal pins, sT, is introduced. The practical limit of sT is estimated by analyzing the actual product data and experimental data. The lower bound of sT, normalized by the grid spacing, can range from 1.5 to 2.0. These results are applied as a guideline to estimate the footprint area per LSI, and to do design tradeoffs among different packaging technologies such as multichip modules (MCM)
  • Keywords
    integrated circuit interconnections; packaging; printed circuit layout; wiring; LSI; adjacent signal pins; footprint area; grid spacing; multichip modules; packaging technologies; signal pin density; via-holes; wireability problem; wiring boards; wiring channels; Costs; Guidelines; Large scale integration; Multichip modules; Packaging; Pins; Signal design; Signal processing; Space technology; Wiring;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.496043
  • Filename
    496043