DocumentCode
907672
Title
Limitation of the signal pin density on wiring boards
Author
Chiba, Tsuneyo ; Yamada, Minoru ; Kobayashi, Fumiyuki
Author_Institution
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
Volume
19
Issue
2
fYear
1996
fDate
5/1/1996 12:00:00 AM
Firstpage
391
Lastpage
396
Abstract
A practical limit of the signal pin density on wiring boards is investigated from the wireability point of view. The wireability problem can be expressed as a supply and demand model of two resources, i.e. wiring channels and via-holes. The limit of the signal pin density is assumed to be determined by the shortage of either of these two resources. As a measure of pin density, the average distance between adjacent signal pins, sT, is introduced. The practical limit of sT is estimated by analyzing the actual product data and experimental data. The lower bound of sT, normalized by the grid spacing, can range from 1.5 to 2.0. These results are applied as a guideline to estimate the footprint area per LSI, and to do design tradeoffs among different packaging technologies such as multichip modules (MCM)
Keywords
integrated circuit interconnections; packaging; printed circuit layout; wiring; LSI; adjacent signal pins; footprint area; grid spacing; multichip modules; packaging technologies; signal pin density; via-holes; wireability problem; wiring boards; wiring channels; Costs; Guidelines; Large scale integration; Multichip modules; Packaging; Pins; Signal design; Signal processing; Space technology; Wiring;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.496043
Filename
496043
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