DocumentCode :
908399
Title :
Fluorine diffusion on a polysilicon grain boundary network in relation to boron penetration from P/sup +/ gates
Author :
Tseng, Hsing-Huang ; Orlowski, Marius ; Tobin, Philip J. ; Hance, Robert L.
Author_Institution :
Motorola Inc., Austin, TX, USA
Volume :
13
Issue :
1
fYear :
1992
Firstpage :
14
Lastpage :
16
Abstract :
The combined effect of boron penetration and fluorine transport from P/sup +/ polycrystalline gates on flat-band voltage is studied. The SIMS concentration depth profiles elucidate the effect of annealing temperature on the fluorine transport, which in turn affects the boron penetration induced change in flat-band voltage. The fluorine diffusion in the poly gate is dominated by grain boundary diffusion. The identification of this mechanism is supported by SIMS profiles and a simulation based on a new methodology of network diffusion.<>
Keywords :
annealing; boron; doping profiles; elemental semiconductors; fluorine; grain boundary diffusion; secondary ion mass spectra; semiconductor doping; silicon; B penetration; F diffusion; SIMS profiles; Si:B, F; annealing temperature effect; concentration depth profiles; flat-band voltage change; grain boundary diffusion; polycrystalline Si gates; polysilicon grain boundary network; semiconductor; Amorphous materials; Amorphous silicon; Annealing; Boron; Channel bank filters; Grain boundaries; Intelligent networks; Temperature; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.144936
Filename :
144936
Link To Document :
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