Determination of Semiconductor Junction Device Package Networks

Author

Greiling, Paul T. ; Laton, Richard W.

Volume

22

Issue

12

fYear

1974

fDate

12/1/1974 12:00:00 AM

Firstpage

1140

Lastpage

1145

Abstract

A generalized method for the determination of semiconductor device package characteristics in the form of linear lumped element networks is described. The method is based upon a computer algorithm for the reduction of mean square error between measured and calculated impedance and is applicable to any package geometry in any microwave circuit media. Impedance measurements are made with the device in situ, without requiring special reference packages. Rapid convergence is obtained by an analysis of the pole-zero configuration of a lossless approximation to the measured data for obtaining initial element values. Results are given for IMPATT and TRAPATT devices in coaxial and microstrip circuits, together with an experimental demonstration of the validity of the result for a TRAPATTdiode in a 20-Omega microstrip circuit.

Keywords

Circuits; Computational geometry; Impedance measurement; Mean square error methods; Microstrip; Microwave devices; Microwave measurements; Microwave theory and techniques; Semiconductor device packaging; Semiconductor devices;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.1974.1128455

Filename

1128455