Title :
Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics
Author :
Patil, Nishad ; Celaya, Jose ; Das, Diganta ; Goebel, Kai ; Pecht, Michael
Author_Institution :
Center for Adv. Life Cycle Eng., Univ. of Maryland, College Park, MD
fDate :
6/1/2009 12:00:00 AM
Abstract :
Precursor parameters have been identified to enable development of a prognostic approach for insulated gate bipolar transistors (IGBT). The IGBT were subjected to thermal overstress tests using a transistor test board until device latch-up. The collector-emitter current, transistor case temperature, transient and steady state gate voltages, and transient and steady state collector-emitter voltages were monitored in-situ during the test. Pre- and post-aging characterization tests were performed on the IGBT. The aged parts were observed to have shifts in capacitance-voltage (C-V) measurements as a result of trapped charge in the gate oxide. The collector-emitter ON voltage VCE(ON) showed a reduction with aging. The reduction in the VCE(ON) was found to be correlated to die attach degradation, as observed by scanning acoustic microscopy (SAM) analysis. The collector-emitter voltage, and transistor turn-off time were observed to be precursor parameters to latch-up. The monitoring of these precursor parameters will enable the development of a prognostic methodology for IGBT failure. The prognostic methodology will involve trending precursor data, and using physics of failure models for prediction of the remaining useful life of these devices.
Keywords :
acoustic microscopy; ageing; failure analysis; insulated gate bipolar transistors; semiconductor device reliability; semiconductor device testing; thermal stresses; IGBT prognostics; SAM analysis; aging characterization test; capacitance-voltage measurement; collector-emitter current; collector-emitter voltage; die attach degradation; failure model; insulated gate bipolar transistor; precursor parameter identification; scanning acoustic microscopy; steady state gate voltage; thermal overstress test; transient voltage; transistor case temperature; Insulated gate bipolar transistors; precursors; prognostics;
Journal_Title :
Reliability, IEEE Transactions on
DOI :
10.1109/TR.2009.2020134