• DocumentCode
    9111
  • Title

    SI-Aware Vias and Contact Pads Layouts and L--R Equalization Technique for 12 Gb/s Backplane Serial I/O Interconnections

  • Author

    Yung-Shou Cheng ; Kang-Wei Chang ; Chia-Tsung Liu ; Ruey-Beei Wu

  • Author_Institution
    Dept. of Electr. Eng., NTU, Taipei, Taiwan
  • Volume
    55
  • Issue
    6
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    1284
  • Lastpage
    1292
  • Abstract
    With increasing demand on higher performance for high-speed blade servers, the signal integrity aware (SI-aware) layouts and equalization have been attributed as the critical techniques to improve the electrical performance. This paper describes the SI-aware layouts of patterned ground and capsule-shaped antipad to enhance the connector performance. Besides, a new differential equalizer by taking advantage of differential via-stubs is proposed to restore the deteriorated eye diagram. Their application of a 117.5-cm SATA-II links demonstrates significant improvement in eye height and timing jitter. Furthermore, a viable approach is suggested to successfully reopen the eyes when the data rate increases from the current 3 to 12 Gb/s. The measurement results are also provided to validate the proposed design concepts.
  • Keywords
    printed circuit interconnections; printed circuit layout; L-R equalization technique; SATA-II links; SI-aware vias; backplane serial I/O interconnections; bit rate 12 Gbit/s; capsule-shaped antipad; connector performance; contact pads layouts; design concepts; deteriorated eye diagram restoration; differential equalizer; differential via-stubs; electrical performance improvement; high-speed blade servers; patterned ground; signal integrity aware layouts; signal integrity-aware vias; size 117.5 cm; Backplanes; Equalizers; Intersymbol interference; Layout; Reflection; Antipad; backplane; blade server; contact pads; equalizer; eye diagram; intersymbol interference; through-hole via; via stub;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2013.2266256
  • Filename
    6547213