Title :
SI-Aware Vias and Contact Pads Layouts and L--R Equalization Technique for 12 Gb/s Backplane Serial I/O Interconnections
Author :
Yung-Shou Cheng ; Kang-Wei Chang ; Chia-Tsung Liu ; Ruey-Beei Wu
Author_Institution :
Dept. of Electr. Eng., NTU, Taipei, Taiwan
Abstract :
With increasing demand on higher performance for high-speed blade servers, the signal integrity aware (SI-aware) layouts and equalization have been attributed as the critical techniques to improve the electrical performance. This paper describes the SI-aware layouts of patterned ground and capsule-shaped antipad to enhance the connector performance. Besides, a new differential equalizer by taking advantage of differential via-stubs is proposed to restore the deteriorated eye diagram. Their application of a 117.5-cm SATA-II links demonstrates significant improvement in eye height and timing jitter. Furthermore, a viable approach is suggested to successfully reopen the eyes when the data rate increases from the current 3 to 12 Gb/s. The measurement results are also provided to validate the proposed design concepts.
Keywords :
printed circuit interconnections; printed circuit layout; L-R equalization technique; SATA-II links; SI-aware vias; backplane serial I/O interconnections; bit rate 12 Gbit/s; capsule-shaped antipad; connector performance; contact pads layouts; design concepts; deteriorated eye diagram restoration; differential equalizer; differential via-stubs; electrical performance improvement; high-speed blade servers; patterned ground; signal integrity aware layouts; signal integrity-aware vias; size 117.5 cm; Backplanes; Equalizers; Intersymbol interference; Layout; Reflection; Antipad; backplane; blade server; contact pads; equalizer; eye diagram; intersymbol interference; through-hole via; via stub;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2013.2266256