• DocumentCode
    912554
  • Title

    Chip Substrate Resistance Modeling Technique for Integrated Circuit Design

  • Author

    Johnson, Thomas A. ; Knepper, Ronald W. ; Marcello, Victor ; Wang, Wen

  • Author_Institution
    IBM General Technology Division, East Fishkill Facility, Hopewell Junction, NY, USA
  • Volume
    3
  • Issue
    2
  • fYear
    1984
  • fDate
    4/1/1984 12:00:00 AM
  • Firstpage
    126
  • Lastpage
    134
  • Abstract
    With the advent of VLSI and the use of statistical simulation techniques to perform integrated circuit design, modeling of chip substrate resistance is becoming increasingly important to successful chip design. This paper will present a substrate resistance modeling technique which may be applied to the design of both FET and bipolar chips. After briefly presenting the theory behind the technique, we will describe its use in developing a substrate resistance model required for studying a disturb problem encountered with a high-speed array chip. The steps involved in building and simplifying the substrate model will be described. The effect on circuit simulations and noise sensitivity will then be shown.
  • Keywords
    Automatic testing; Circuit testing; FETs; Integrated circuit modeling; Integrated circuit synthesis; Radar antennas; Space technology; System testing; Very large scale integration; Voltage;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.1984.1270066
  • Filename
    1270066