DocumentCode
912554
Title
Chip Substrate Resistance Modeling Technique for Integrated Circuit Design
Author
Johnson, Thomas A. ; Knepper, Ronald W. ; Marcello, Victor ; Wang, Wen
Author_Institution
IBM General Technology Division, East Fishkill Facility, Hopewell Junction, NY, USA
Volume
3
Issue
2
fYear
1984
fDate
4/1/1984 12:00:00 AM
Firstpage
126
Lastpage
134
Abstract
With the advent of VLSI and the use of statistical simulation techniques to perform integrated circuit design, modeling of chip substrate resistance is becoming increasingly important to successful chip design. This paper will present a substrate resistance modeling technique which may be applied to the design of both FET and bipolar chips. After briefly presenting the theory behind the technique, we will describe its use in developing a substrate resistance model required for studying a disturb problem encountered with a high-speed array chip. The steps involved in building and simplifying the substrate model will be described. The effect on circuit simulations and noise sensitivity will then be shown.
Keywords
Automatic testing; Circuit testing; FETs; Integrated circuit modeling; Integrated circuit synthesis; Radar antennas; Space technology; System testing; Very large scale integration; Voltage;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.1984.1270066
Filename
1270066
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