DocumentCode
912792
Title
The perforated emitter contact effect
Author
Hamel, J.S. ; Roulston, D.J. ; Selvakumar, C.R.
Author_Institution
Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
Volume
13
Issue
2
fYear
1992
Firstpage
114
Lastpage
116
Abstract
A new phenomenon, the perforated emitter contact effect, is described. It arises when numerous extremely small gaps or perforations are introduced to an interfacial oxide layer in the emitter region of a bipolar transistor. Two-dimensional simulation of a novel emitter structure that incorporates a perforated interfacial layer indicates that such a layer can provide significant current gain enhancement with a negligible increase in series emitter resistance. These results have implications for polysilicon emitter bipolar transistors and suggest that significant tradeoffs between emitter resistance and current gain can conceivably be obtained if an intentionally grown interfacial oxide layer is thermally annealed so as to break up the oxide just enough to create numerous small perforations.<>
Keywords
bipolar transistors; minority carriers; semiconductor device models; 2D simulation; bipolar transistor; current gain enhancement; emitter resistance; interfacial oxide layer; perforated emitter contact; polysilicon emitter; thermal annealing; Annealing; Bipolar transistors; Computational modeling; Computer interfaces; Doping; Insulation; Semiconductor devices; Testing; Thermal resistance; Very large scale integration;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.144976
Filename
144976
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