• DocumentCode
    912792
  • Title

    The perforated emitter contact effect

  • Author

    Hamel, J.S. ; Roulston, D.J. ; Selvakumar, C.R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
  • Volume
    13
  • Issue
    2
  • fYear
    1992
  • Firstpage
    114
  • Lastpage
    116
  • Abstract
    A new phenomenon, the perforated emitter contact effect, is described. It arises when numerous extremely small gaps or perforations are introduced to an interfacial oxide layer in the emitter region of a bipolar transistor. Two-dimensional simulation of a novel emitter structure that incorporates a perforated interfacial layer indicates that such a layer can provide significant current gain enhancement with a negligible increase in series emitter resistance. These results have implications for polysilicon emitter bipolar transistors and suggest that significant tradeoffs between emitter resistance and current gain can conceivably be obtained if an intentionally grown interfacial oxide layer is thermally annealed so as to break up the oxide just enough to create numerous small perforations.<>
  • Keywords
    bipolar transistors; minority carriers; semiconductor device models; 2D simulation; bipolar transistor; current gain enhancement; emitter resistance; interfacial oxide layer; perforated emitter contact; polysilicon emitter; thermal annealing; Annealing; Bipolar transistors; Computational modeling; Computer interfaces; Doping; Insulation; Semiconductor devices; Testing; Thermal resistance; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.144976
  • Filename
    144976