DocumentCode :
912792
Title :
The perforated emitter contact effect
Author :
Hamel, J.S. ; Roulston, D.J. ; Selvakumar, C.R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
Volume :
13
Issue :
2
fYear :
1992
Firstpage :
114
Lastpage :
116
Abstract :
A new phenomenon, the perforated emitter contact effect, is described. It arises when numerous extremely small gaps or perforations are introduced to an interfacial oxide layer in the emitter region of a bipolar transistor. Two-dimensional simulation of a novel emitter structure that incorporates a perforated interfacial layer indicates that such a layer can provide significant current gain enhancement with a negligible increase in series emitter resistance. These results have implications for polysilicon emitter bipolar transistors and suggest that significant tradeoffs between emitter resistance and current gain can conceivably be obtained if an intentionally grown interfacial oxide layer is thermally annealed so as to break up the oxide just enough to create numerous small perforations.<>
Keywords :
bipolar transistors; minority carriers; semiconductor device models; 2D simulation; bipolar transistor; current gain enhancement; emitter resistance; interfacial oxide layer; perforated emitter contact; polysilicon emitter; thermal annealing; Annealing; Bipolar transistors; Computational modeling; Computer interfaces; Doping; Insulation; Semiconductor devices; Testing; Thermal resistance; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.144976
Filename :
144976
Link To Document :
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